Description: Normal 0 false false false EN-US X-NONE X-NONE Thin Film Multi-Chip Modules by Messner, Turlik, Balde, Garrou International Society for Hybrid Microelectronics 1992 Hardcover 699 Pages ISBN 093081533 Condition Very Good, No Marks No Stickers and Appears Never Read. Table of Contents Introduction Background to MCM Technology Main Construction Approaches for Mcm-D Materials of Construction, Substrate, Dielectric, Metalization Interconnection Design and Process Characteristics for Digital Multi-Chip Modules Operating At High System Clock Rates Custom and Semi Custom Mcms Use of Passive Components Assembly Multi-Chip Module Package Design Multi-Chip Module Connections Cad, CAE Thermal Management Testing Economic Situations Multi-Chip Module Design and Manufacturing Cost Considerations Perspectives for the Future Contributors Index Also Index of References by Contributors by Name, Extensive List Quite, with professional backgrounds; Useful.
Price: 25 USD
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Book Title: The Film:Multichip Modules
Title: Thin Film: Multichip Modules
MPN: Does not apply
Publisher: International Society for Hybrid Microelectronics
Item Length: 9 in
Original Language: English
Intended Audience: Adults
Modified Item: No
Publication Year: 1992
Format: Hardcover
Language: English
Item Height: 2 in
Author: George Messner, Iwona Turlik, John W. Balde, Philip E. Garrou
Genre: Engineering & Technology
Topic: Microelectronics
Subjects: Engineering & Technology
Item Weight: 45 oz
Item Width: 6 in
Number of Pages: 699
